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February 2002

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Subject:
From:
Bartkowaik Christine <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 13 Feb 2002 11:20:47 -0500
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Jerry:

I use the same paste and profile to build double-sided boards with no
problems.
The side with the "lighter" componets is built first.

Chris

-----Original Message-----
From: Jerry Mosur [mailto:[log in to unmask]]
Sent: Wednesday, February 13, 2002 10:09 AM
To: [log in to unmask]
Subject: [TN] Reflow Process


Hello,

As a part of our preparations to set up an internal SMD line, I would like
to get your opinion on the following topic.
What are the problems, if any, associated with reflowing the double sided
SMT board using solder paste with different melting points for top and
bottom.
Is this a fairly common process?
If not what would you recommend as a best assembly process for double sided
SMT boards?


Thanks in advance,

Jerry

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