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February 2002

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Subject:
From:
Eric Dawson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 13 Feb 2002 08:21:18 -0000
Content-Type:
text/plain
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text/plain (62 lines)
Barbara,
I have information------don't do it.
A while ago I was faced with expensive boards that were failing bench test.
We could get them going temporarily by placing a finger on the bga
components. Since that firm didn't supply a test engineer's finger with
every product, the onus was on me to sort it.
Having measured the temperature underneath the bga during bottom side wave
soldering at about 180 Celsius I decided that we either mask the bga vias
comprehensively with peelable mask and use a jig or go double sided reflow.
In this particular case DSR was the answer with a few pin-in-holes thrown
in. The problem went away.
Hope this helps
Regards
Eric Dawson

> -----Original Message-----
> From: Rich, Barbara J [SMTP:[log in to unmask]]
> Sent: Tuesday, February 12, 2002 10:12 PM
> To:   [log in to unmask]
> Subject:      [TN] bga's
>
> Does anyone have information on reliability issues that have been caused
> by
> wave soldering a board that has BGA's without a fixture. Any information
> will be helpful.
>
> Thanks,
> Barb Rich
> Sr. Eng.Asst./Seritrack Support
> Phone 303-661-8956
> pgr.303.649.8366
> INFORMATION made POWERFUL
>
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