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February 2002

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Mon, 11 Feb 2002 10:49:50 EST
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Mr. Koh:

If I may speak openly for all my beleaguered collegues/customers, as they
would be afraid to discuss this openly with Motorola...

The most important characteristics of potential plating quality really cannot
be measured in any programmable way, save by looking at results.

It takes great understanding and intelligence to set up and run a plating
process in the modern PCB facility, and no amount of ISO standardization can
monitor that.

You will certainly get vast amounts of data about "control" of plating
systems, but at the end of the day, it is only slightly above a "black art",
and the most important aspects, design of the tanks, and fluid flow, are not
understandable to outside audit teams.  Further, issues like plating rate,
anode placement, etc. can change with every job.

You can run test coupons with every load, but it will not tell you if the PCB
is being plated correctly.

Look at results on the PCB...that is the only real truth....the rest is
largely window dressing, and often expensive and difficult to obtain window
dressing.

Rudy Sedlak
RD Chemical Company

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