TECHNET Archives

February 2002

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet E-Mail Forum.
Date:
Sun, 10 Feb 2002 13:03:22 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (27 lines)
Hi Steve,
In a message dated 02/09/2002 20:53:56, [log in to unmask] writes:
>One other question that I'll throw-out there, is why in the hell do companies
>like Texas Instruments put components on the market that can't be assembled
>with standard processes?

The component suppliers have all conspired to make sure consultants are not
short of work.
Seriously though, it is a sad fact that component suppliers, with very few
notable exceptions are a part of the problem and have a serious
throw-it-over-the-wall attitude.
It started with LLCCCs, followed by plastic components with Alloy 42
leadframes and leads (TSOP, SOT), SBGAs, CBGAs, ....you name it.

Werner Engelmaier

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2