.... tacky past fux, eh? Never thought of bringing any of those to work.
Peter
tuan.bui@CONE
XANT.COM To: [log in to unmask]
Sent by: cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST
TechNet Aero/ST Group)
<[log in to unmask] Subject: Re: [TN] BGA Rework Using Paste vs.
ORG> No Paste
02/01/02
02:58 AM
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E-Mail
Forum.";
Please
respond to
tuan.bui
Jeff,
We have been working and reworking BGA and Micro BGA for quite sometime.
This is a requirement in a prorotye environment. We tried using micro
stencil when we first attempt to replace the BGAs and found out that using
micro stencil was not a good method. We then tried using no-clean tacky
past fux and applied to both the BGA and the PWB substrates. This process
has been adopted in our process and has been working well for us. Here are
some great benefit of using flux paste only.
- No micro stencil cost.
- No cleaning is needed (No-clean flux).
- No aligning equipment is needed, since we can place the BGA into its
footprints without worry about smearing the solder paste, and if the
hand alignment if off ( no more than 50%), the liquid tension of the
reflowed solder balls will pull it back.
- Save time and money. ( stencil cost, cleaning, and aligning).
If the solder balls on the BGA are made of non-eutectic, solder paste is
required.
Tuan Bui
Conexant Systems Inc.
Prototype Process Dev. Eng.
Jeff Ferry
<jferry@CIRCUITTE To: [log in to unmask]
CHCTR.COM> cc:
Sent by: TechNet Subject: [TN] BGA Rework
Using Paste vs.
<[log in to unmask]> No Paste
01/31/02 08:54 AM
Please respond to
"TechNet E-Mail
Forum."; Please
respond to Jeff
Ferry
Fellow TechNetters,
We nearly always apply solder paste to the circuit board when we replace
BGA components during rework. Yet, after speaking with a handfull of BGA
equipment companies at APEX, seems like they all recommend using flux only
vs. paste, unless the circuit board is used in a high rel application.
What do ya'all do/recommend for BAG rework? Can you point me to any
studies/reports on the subject?
Thanks,
Jeff Ferry
CEO
Circuit Technology Center, Inc.
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