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February 2002

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Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 8 Feb 2002 16:00:07 -0600
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I'm with you Werner on this one. Still haven't figured out how the balls
fell of the initial run of TI parts and stuck to the PCB.

Hell, I just found out these parts only appear ceramic. They may not be
though aluminum tops may be made to appear such. Worse may be the flip chip
design on ceramic with some interposer, maybe, with a CTE of 3. I'm not
getting much help from the supplier. I am getting help from users with
information both good and bad

The good info says it is very likely good solder joints may be effected
under very well managed design, fabrication, and stencil concitions. The bad
is other people like my company experiencing nothing but bad as initially
poor quality notwithstanding poor long term, whatever that is, reliability.

What the hell brings you out of your cave?

MoonCaveMan

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