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February 2002

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Subject:
From:
Barry Gallegos <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 8 Feb 2002 06:05:28 -0700
Content-Type:
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text/plain (98 lines)
Good morning Antonio,
I seem to recall some one referring me to ANSI/J-STD-001 series documents.
these will be the ones that control processing and qualification guidelines
for fluxes and the like. 

I believe. (not really sure)

Barry

-----Original Message-----
From: Busko, Wolfgang [mailto:[log in to unmask]]
Sent: Friday, February 08, 2002 2:04 AM
To: [log in to unmask]
Subject: Re: [TN] Soldering Process


Hi Antonio,

seems "someone" has forgotten your problem.
As a start you may consider IPC document A-610 Rev C Acceptability Of
Electronic Assemblies.
On the topic of reliability tests and a hint to the appropriate standard
there was a thread a couple of days ago, canīt remember the exact subject
so, maybe someone else can.

Good luck 
Wolfgang

> -----Original Message-----
> From: Antonio Souza [mailto:[log in to unmask]]
> Sent: Wednesday, February 06, 2002 6:24 PM
> To: [log in to unmask]
> Subject: [TN] Soldering Process
> 
> 
> Please
> 
> I need to qualify my Soldering Process( Electronic components ). Could
> someone suggest some tests to be performed and some Documents 
> or Standards
> for Reference !
> Did somebody know anything about Thermal Shock to check the solder
> conection?
> 
> thanks
> 
> Antonio Souza
> INPE/Brazil
> 
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