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February 2002

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Subject:
From:
"Busko, Wolfgang" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 8 Feb 2002 10:18:43 +0100
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text/plain (69 lines)
Hi Peter,

you may start with IPC/JEDEC J-STD-033. You can download this standard from
the download section of IPC.
If the criteria in that document meet the requirements for your tape and
reel material should be checked with your supplier.

Good luck
Wolfgang

> -----Original Message-----
> From: peter lee [mailto:[log in to unmask]]
> Sent: Thursday, February 07, 2002 6:06 PM
> To: [log in to unmask]
> Subject: [TN] Baking MSP components on Tape and Reel
>
>
> Does anyone have any experience baking out moisture
> from MSP components on Tape and Reel?
>
> What is the criteria and guidelines for this process?
> (material, oven temp. baking time etc.)
>
> In case if the components cannot be baked on the reel
> due to heat sensitive cover tape material, are there
> any companies out there that I can outsource this task
> (baking/ re-T&R, repacking)?
>
>
> Rgds,
> Peter
>
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