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February 2002

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 20 Feb 2002 09:03:10 -0500
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text/plain (32 lines)
There was a pretty good thread on this subject last year. Check the archives
Highlights, stronger wetting forces, less leaching, brighter joints.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Antonio Souza
> Sent: Tuesday, February 19, 2002 8:59 AM
> To: [log in to unmask]
> Subject: [TN] Solder
>
>
> Please
>
> Could someone tell me the advantages and disadvantages of using solder
> Sn/Pb/Ag  instead of Sn/Pb.
>
>
> Thanks
>
> Antonio
> Inpe-Brazil

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