Hi Dyane
I believe we met a couple of years ago while receiving our IPC-A-610C
training in Colorado. Hello again.
I don't hav definitive answers to your question but I looked in the IPC 7711
Rework of Electronic assemblies and on page 5,paragraph 1.9.2, it states
that the first step in Surface mount land preparation is "Remove Old
Solder". So I think that answers the surface mount part of the question.
I could not find as clear an answer to the through hole part of the
question. If the rework entails component removal then you would have to
remove the old solder to insert the new component. But what about your
situation of installing a jumper wire. I could not find a sure answer to
that one. Please pass on any answers you may get.
Good to see we are both putting our training to good use.
Thanks
Tim McQuay
Training Coordinator
Vansco Electronics
101 Irene St.
Winnipeg, MB
Canada
e-mail: [log in to unmask]


-----Original Message-----
From: Dyane White [mailto:[log in to unmask]]
Sent: 2002/January/Thursday 4:07 PM
To: [log in to unmask]
Subject: [TRAINERNET] Solder removal


Greetings,

I posed this question before and have not received an answer, so here is is
again.  Is it documented anywhere that you must remove solder from a through
hole or a surface mount pad before replacing a component or adding a jumper
wire?  There is quite a
debate about this issue at our company and I can't find any documentation to
support this issue either yea or nay.  Reheating a solder joint repeatedly
is not recommened so this is the reasoning behind one argument but where
does it say to remove or to
leave solder before reworking the joint?  An example is: A via is filled
with solder and a jumper wire is to be added.  Do you remove the solder that
is in the via and place the wire then add new solder, or do you reheat the
existing solder and add the
wire?  Help, I'm caught in the middle!!!

Dyane White
Technical/Process Trainer
Philips Ultrasound

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