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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 5 Feb 2002 16:21:47 -0600 |
Content-Type: | multipart/mixed |
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Well, we use a part just like it from the same mfg. The process they are using is making a through hole part a surface mount package by coining the leads. Use the coined requirements. Which for CL 3 is 150% of the lead diameter or thickness at a minimum. Interesting issue we haven't had any leads that have any bend on them. We have been having good results for complete wetting. Is it possible that the part is being placed too hard?
I'm off to look at inventory.
Kathy
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<DIV>Well, we use a part just like it from the same mfg. The process they
are using is making a through hole part a surface mount package by coining the
leads. Use the coined requirements. Which for CL 3 is 150% of the
lead diameter or thickness at a minimum. Interesting issue we haven't had
any leads that have any bend on them. We have been having good results for
complete wetting. Is it possible that the part is being placed too
hard?</DIV>
<DIV> </DIV>
<DIV>I'm off to look at inventory. </DIV>
<DIV> </DIV>
<DIV>Kathy </DIV></BODY></HTML>
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