TECHNET Archives

January 2002

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Darrel Therriault <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 3 Jan 2002 17:06:50 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (34 lines)
TechNet,

What considerations are used for selecting the thickness and aperature
of a solder stencil?  I would guess it has to do with solder volume and
maybe proximity/spacing, but are there other things considered as well?
Are there any "rules of thumb" or guidelines for making this selection
or standards?

All comments and preferences appreciated.

DT





--
Darrel Therriault
VP, Mfg. Operations
INCEP Technologies, Inc
(858)547-9925 223
[log in to unmask]

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To recieve ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2