Hi Technetters,

We are working on several projects – Panel Layout
Standardization, Future P&P Platform Evaluation, etc.,
in which the ratio between Restier/Cap and ICs is a
critical factor.

For Regular DIMM, Register DIMM, etc.  the ratios are
all figured out.  However, as I look at the DDR Future
Roadmap and its market share the current DDR modules
we are making, I realize that this change has to be
considered seriously: We need your help!

Please advise us, what would be the Resister/Capacitor
– ICs ratio (or common ratio) of PCXXXX 184 Pin DIMM
and PCXXXX 200-Pin SO-DIMM:

1. 64Mb – x4, x8, x16, x32, 1 and 2 generation using:
  a. TSOP66
  b. FBGA
2. 128Mb – x4, x8, x16, x32, 1 and 2 generation using:
  a. TSOP66
  b.  FBGA
3. 256Mb – x4, x8, x16, 1 and 2 generation using:
  a. TSOP66
  b. FBGA
4. 512Mb – x4, x8, x16,, 1 and 2 generation using:
  a. TSOP66
  b.  FBGA

Also, besides the standard dimension: 125” x 5.25 –
184-Pin DIMM, 1.00” or 1.25” x 2.66” – 200-Pin SODIMM,
are there any other alternative dimension that
different memory designer/manufacture may employ?

Your help is greatly appreciated.

Stacy

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