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January 2002

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Date:
Thu, 31 Jan 2002 19:28:04 -0500
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We have been having a problem with Dupont silver CB100 VIA Plug.  The
boards are 12 layer, .062", FR4, Nickel/Gold plated.
We have a BGA pattern with VIA in hole.  The VIAs are filled with CB100 VIA
plug and then the board is plated.
The VIAs are .010 causing an aspect ratio of 6.2:1.  We are seeing after
solder reflow, inner layer delamination in the area of the
VIA filled BGA patterns.  Has anyone seen this before?  Does anyone use a
similar construction and had success?  There are a few
theories flying around but I wanted to ask the IPC community for any
insight.  Thank you in advance.

Best Regards,

Mike Forrester
Sr. Manufacturing Engineer
[log in to unmask]

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