Jeff,

No studies to cite, but in our admittedly informal internal testing
we've found consistently better yields using paste rather than flux for
BGA replacements.  Some of this may be due to the condition of pcb and
pads on the boards after removal but we really haven't studied it in
detail.

Rick Thompson
Ventura Electronics Assembly
2655 Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858   x-304  voice
+1 (805) 584-1529 fax
[log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jeff Ferry
Sent: Thursday, January 31, 2002 8:54 AM
To: [log in to unmask]
Subject: [TN] BGA Rework Using Paste vs. No Paste


Fellow TechNetters,

We nearly always apply solder paste to the circuit board when we replace
BGA components during rework. Yet, after speaking with a handfull of BGA
equipment companies at APEX, seems like they all recommend using flux
only vs. paste, unless the circuit board is used in a high rel
application.

What do ya'all do/recommend for BAG rework? Can you point me to any
studies/reports on the subject?

Thanks,

Jeff Ferry
CEO
Circuit Technology Center, Inc.

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