Ed
If they do change to no-clean, please give me a name so I know who not to use!!! :-)
Seriously, I'd have some serious issues with this. There is no way they can know what the end use of the part is - unless they ask each time and tailor the process to fit. So someone might end up with a big hidden problem. Potentially the end user has a no-clean residue in an application that won't tolerate it, or they process the board with a wash and they end up with a mystery residue (as has been discussed on TechNet previously).
I have to ask though, can they process them fast enough that they aren't worried about moisture from the air?
Doesn't sound like a great plan to me...
regards
Graham Collins
Process Engineer,
Northrop Grumman
Atlantic Facility of Litton Systems Canada
(902) 873-2000 ext 6215
>>> [log in to unmask] 01/31/02 01:22PM >>>
Hi all,
I've found this thread to be very interesting and informative, but would like to present a "different twist" to the subject:
I have a client using our Reballing system to recondition all sorts of BGA and uBGA for re-use after de-soldering. They are currently using a water soluble paste and cleaning with DI, however the residual absorbed moisture presents a concern, so the devices are baked after cleaning. This increases turnaround time, so they are considering moving to a no-clean process.
My opinion is that there will be residues and they could possibly be incompatible with subsequent platforms utilized by the end user, as well as creating aesthetic impact. Cleaning alternatives for no-clean fluxes rival the more aggressive (therefore more forgiving) water solubles, so the benefit is lost if cleaned.
Any and all opinions, theories, suggestions and experiences are welcomed!
Regards,
Ed Popielarski
QTA Machine
10 Mc Laren, Ste D
Irvine, Ca. 92618
Phone:949-581-6601
Fax: 949-581-2448
Cel: 949-337-2578
www.QTA.NET
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