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January 2002

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Subject:
From:
"McMullen, Kerry" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 31 Jan 2002 12:44:04 -0500
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Hi Jeff,
For our eutectic PBGA's, we only flux (no clean).  Have only done about 50
or so over the past year with very good (97% yield) results.
Have not seen any studies or papers.  Just worked closely with our CM to
create the profile for each type of BGA.  We use Air-Vac.
Kerry

-----Original Message-----
From: Jeff Ferry [mailto:[log in to unmask]]
Sent: Thursday, January 31, 2002 11:54 AM
To: [log in to unmask]
Subject: [TN] BGA Rework Using Paste vs. No Paste


Fellow TechNetters,

We nearly always apply solder paste to the circuit board when we replace
BGA components during rework. Yet, after speaking with a handfull of BGA
equipment companies at APEX, seems like they all recommend using flux only
vs. paste, unless the circuit board is used in a high rel application.

What do ya'all do/recommend for BAG rework? Can you point me to any
studies/reports on the subject?

Thanks,

Jeff Ferry
CEO
Circuit Technology Center, Inc.

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