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January 2002

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Subject:
From:
Mark Charlton <[log in to unmask]>
Reply To:
Mark Charlton <[log in to unmask]>
Date:
Thu, 31 Jan 2002 12:22:19 -0500
Content-Type:
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text/plain (61 lines)
Jeff,

My "rule of thumb" is plastic BGA's with eutectic balls - I use stick flux
only.  For ceramic BGA's with non-eutectic or "hard" balls, I must use a
microscreen and apply solder paste.

Mark

----- Original Message -----
From: "Jeff Ferry" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, January 31, 2002 11:54 AM
Subject: BGA Rework Using Paste vs. No Paste


> Fellow TechNetters,
>
> We nearly always apply solder paste to the circuit board when we replace
> BGA components during rework. Yet, after speaking with a handfull of BGA
> equipment companies at APEX, seems like they all recommend using flux only
> vs. paste, unless the circuit board is used in a high rel application.
>
> What do ya'all do/recommend for BAG rework? Can you point me to any
> studies/reports on the subject?
>
> Thanks,
>
> Jeff Ferry
> CEO
> Circuit Technology Center, Inc.
>
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