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January 2002

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From:
kevinyeah <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 31 Jan 2002 14:09:29 +0800
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Robisan1,Hello!



why you think today's laminate system would not cause resin recession? Would you mind to tell me some informations about today's laminate system,which you know well. what's the difference between today's and past's in resin system? I concern about it very very much.

Anyway, resin recession is due to resin system,this what some PCB technical people told me.So it bother me for a long time.However I don't know what's the correct answer of the reason, then I don't know how to solve this defect either.If you have any opinion on it please give me some advices.                       



Best regards,



KevinYeah



======= 2002-01-16 14:15:00 您在来信中写道:=======



>We see boards from many, many board shops and 95 of them have little if any

>resin recession or hole wall pullaway in their boards prior to or after

>thermal stress.

>

>With today's laminate systems and plating systems the condition should not

>exist.

>

>Many years ago I had this discussion with a friend in the industry, Terry

>Kingston, now in another industry and he acused me of wanting a perfect

>board.  My reasoning is that if I have two board shops - one with good hole

>wall adhesion and one with little hole wall adhesion - I am going to buy from

>the one with good adhesion.  The other boards may be spec compliant, but they

>are just not as robust - all other attributes being equal.

>

>I can see where insertion of pins could result in peeling if the hole wall

>was not attached and that is a concern.

>

>My two cents

>

>Susan Mansilla

>Robisan Lab

>

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               kevinyeah

               [log in to unmask]

					2002-01-29 

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