Thanks everyone for your help. The article at
www.circuitree.com "Copper Plating of Electronic
Interconnects without Additives" was very helpful
indeed. By "additives" they are referring to
brighteners and levelers. The bath they described
contained polyethylene glycol.

This article lead me to find two more lnks.

http://www.pcfab.com/db_area/archive/2001/0103/taylor.html

And US patent 6,303,014, which describes the "additive
free" process in greater detail. However, they
also use a "supressor", such as polyethelene
glycol in combination with the chloride ion.

http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1
&u=/netahtml/srchnum.htm&r=1&f=G&l=50&s1='6,303,014'.WKU.&OS=PN/6,303,014&RS
=PN/6,303,014

In reply to Rudy Sedlak, I beginning to see that
the rectifier cannot be a total solution.

Adam Seychell

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