This component package is a pain in a spot somewhat below the neck, because
of the slug of metal used for a heat sink in the package. Issues are:
* Process measurement needs to be measured on the solder balls [both at the
inner row and the corner]. The difference in CTE of all the elements of this
package can make it difficult to profile otherwise.
* Process verfication with a common xray machine is close to futile.
Further, in these TI DSP, Dr. Cemel Basaran, SUNY Buffalo, 716-645-2114
X2429, [log in to unmask] has seen:
* Thinner [2 micron] than normal [20-micron ] AuSn4 IMC
* Black pad
Dave Fish
----- Original Message -----
From: "Earl Moon" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, January 30, 2002 10:48 AM
Subject: [TN] CSP/DSP SOLDERING PROBLEM?
> Folks,
>
> Have some CSP's that are TI DSP's (320c6203 TMX 320C6203 BGLS), or some
such
> thing. I can't imagine there being solderability issues with these things,
> but then I didn't think I'd live this long. However, after examining all
> other possible process variables, and resolving them to some extent, these
> things look to be the last straw.
>
> Solder joints on these parts, mostly, aren't. The "C" clamp thing picture
is
> holding one of the critters on the board to make electrons flow.
>
> Does anyone have any issues with these parts and their solderability? I do
> appreciate the assistance. Steve, these probably are coming your way.
>
> Earl
>
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