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January 2002

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Subject:
From:
Graham Naisbitt <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 30 Jan 2002 17:03:30 -0000
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Olivia

No clean fluxes leave residues.

J-STD-001B (can't quote issue C because I don't have a copy to hand) states:

8.3.5 Flux Residues

Assemblies shall be tested in accordance with IPC-TM-650, Test Method 2.3.27
and shall comply with the following requirements for the maximum allowable
level of flux residues:

Class 1 assemblies less than 200 microgram's/sq cm
Class 2 assemblies less than 100 microgram's/sq cm
Class 3 assemblies less than 40 sq/sq cm


In case you don't know the classifications

Class 3 is safety critical products - e.g. gas meters, military hardware,
ABS, air bag or engine management stuff etc..
Class 2 is service dependant products - UPS systems, process plant control
and stuff that doesn't necessarily endanger life but matters if it breaks!
Class 1 is low consequence product - PC's, phones, toys etc..

As to the failures you mention, flux residues + moisture + electricity =
trouble.

Hope this helps.

Regards Graham Naisbitt

[log in to unmask] <mailto:[log in to unmask]>

Concoat Limited
Alasan House, Albany Park
Camberley GU16 7PH - UK

www.concoat.co.uk <http://www.concoat.co.uk>

Phone: +44 1276 691100
Fax: +44 1276 691227
Mobile: +44 79 6858 2121


> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Olivia Mc Dermott
> Sent: 30 January 2002 13:48
> To: [log in to unmask]
> Subject: [TN] Flux residue with a no-clean process
>
>
> Is it OK to have flux residue on assemblies when the process is
> no clean. We
> have assemblies that are failing in the field and the customer thinks this
> flux residue may be an issue. They think the assembly has been wet.
> What do you think???? All help appreciated.
>
> _________________________________________________________________
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