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January 2002

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Date:
Wed, 30 Jan 2002 16:05:36 +0100
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Hi Kathy,

I am very interested in this as we have the following processes:

1.      No clean smt - no clean wave solder - saponified wash
2.      No clean smt - clean wave solder - aqueous wash.

Could you please advise why this would be detrimental. Would this affect the
reliability of the joints and if so is there a paper on this.

Thanks for your help.

Best regards

Marc.
-----Original Message-----
From:   Kathy Kuhlow [mailto:[log in to unmask]]
Sent:   Wednesday, January 30, 2002 2:20 PM
To:     [log in to unmask]
Subject:        Re: [TN] Flux residue with a no-clean process

 << File: TEXT.htm >> IPC-610 has no-clean residues as acceptable.  Is it
possible that flux may have been mixed with a washable?  Washing a no-clean
off is more detrimental than leaving it alone.

Is the assembly conformally coated?  Is the application intended to be in a
wet or high humidity/moisture enviroment?

Kathy

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