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January 2002

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Subject:
From:
"McMullen, Kerry" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 30 Jan 2002 09:32:09 -0500
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Been placing and convection reflowing these (along with the PBGA's ) for
over 2 years with no change to my profiles.

-----Original Message-----
From: bbarr [mailto:[log in to unmask]]
Sent: Wednesday, January 30, 2002 9:10 AM
To: [log in to unmask]
Subject: [TN] TBGA


Engineering here is looking at a TBGA600 for a project (tape ball grid
array). We have been working with PBGAs for years, but I am not familiar
with a TBGA. Is there anything unique about the TBGA as far as processing on
the assembly line as opposed to a PBGA? The package size is 40mm square and
1.55mm high, .75mm dia. balls on 1.27mm centers.

Thanks,

Bob

==========================
Robert Barr
Manufacturing Engineering
Formation, Inc.
Voice: 856-234-5020 x3035
Fax: 856-234-6679

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