TECHNET Archives

January 2002

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Olivia Mc Dermott <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 30 Jan 2002 13:48:28 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (20 lines)
Is it OK to have flux residue on assemblies when the process is no clean. We
have assemblies that are failing in the field and the customer thinks this
flux residue may be an issue. They think the assembly has been wet.
What do you think???? All help appreciated.

_________________________________________________________________
Join the world’s largest e-mail service with MSN Hotmail.
http://www.hotmail.com

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2