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January 2002

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Subject:
From:
Ted Stern <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 29 Jan 2002 12:15:47 -0600
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Kirk:

It has been some time since performing this test, but if memory serves
tin is measured chemically by ASTM E46; impurities (including copper,
gold, cadmium, zinc, aluminum, antimony, iron, arsenic, bismuth, silver,
and nickel), are measured spectrometrically (AA) by ASTM E663; and lead
is reported as the  "balance".

I am unsure of the ASTM designation for ICP determination, but the
general digestion method described in E663 may be the same for ICP.  If
silver is being determined, keep in mind aqua regia (HCl/HNO(3)) cannot
be employed as to dissolve the sample.

As previously mentioned, your current solder supplier should perform
this test for you AND provide you a copy of the method employed.

Regards,
Ted Stern

Kirk Kosel wrote:

>  Thanks for the responses.  One more question, any idea on how to get
> the solder (and impurities) in solution for ICP analysis? Thanks again
> for your help, Kirk

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