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January 2002

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Subject:
From:
David Douthit <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 28 Jan 2002 18:06:13 -0700
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Werner,

This looks like something someone "made up" without any reasoning to it.

David A. Douthit
Manager
LoCan LLC

[log in to unmask] wrote:

> Hi "Regards,"
> First, we normally put names at the bottom of our messages.
> You, in a message dated 01/28/2002 13:22:10, [log in to unmask] write:
> >Being from purchasing, I have been asked to rationalize the inherent cost for
> >demanding quality standards that my company now prescribes to.
> >Below, I have outlined our company's test criteria for environmental stress
> testing:
> A: You do not tell us what the purpose of your "environmental stress testing"
> is supposed to be; nor are you telling us on what units [proptotypes,
> coupons, scrp samples, etc.] these tests are to be performed or any test
> details; nor are you giving us any design details--consequently, it is very
> difficult to say anything pertinent about your tests and your product. You
> also do not tell us what the cryptic X1 through X5 means--number of cycles,
> sequence?
>
> >Panel Allocation                             Test Description
> >Thermal Cycle -55C / 150C    X1            15 Min x 2 x 100; Test PC boards
> without components
> >Humidity 85/85                     X2            7 Days; Test complete units
> >150C Bake                            X3              7 Days
> >Hot Plate/ Oil Temp Shock     X4            10 Sec x 20  0C-100C Water Dip
> >Via Current                           X5              7 Days / 14 cycles @
> 25C & 125C
> >
> >Below, I have outlined several questions so that I can attain a richer
> >understanding of the intent, benefit and drawbacks of environmental stress
> testing:
> >a.  How would moisture absorption effect results of environmental stress
> testing?
> A: Which test?
> >b.  How would soldermask adhesion be effected by environmental stress
> testing?
> >c.  How is oxidation formed; is it a function of water
> absorption/environmental exposure?
> >d.  What could cause via current test (the via are burnt and opened) after
> environmental stress testing?
> A: not enough details.
> >e.  If our product is not exposed to any harsh environmental conditions, what
> >is the benefit for this type of testing?
> A: None.
> Generally speaking, your tests are extreme--without stated details and
> purposes general statements are meaningless.
>
> Werner Engelmaier
> Engelmaier Associates, L.C.
> Electronic Packaging, Interconnection and Reliability Consulting
> 7 Jasmine Run
> Ormond Beach, FL  32174  USA
> Phone: 904-437-8747, Fax: 904-437-8737
> E-mail: [log in to unmask], Website: www.engelmaier.com
>
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