TECHNET Archives

January 2002

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 28 Jan 2002 10:22:44 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (26 lines)
Though I kinda like the look of the solder joints, I do believe they may be
a little light on the solder paste volume having been printed using a 5 mil
thick stencil. The thickness is fine for .8 mm stuff and xfine pitch QFP's.
However, I have used step down foils, from 6.5 mils to 5 mils, to ensure
specified paste volume for all parts to accomodate the 1206 types as well.

Also, as previously discussed, I reduce BGA pad sizes 20% from device ball
sizes. For my current design, with a 5 mil thick stencil, I'm printing one
to one with the pad size.

Can I hear an Ahmen from all you SMT brethren out there or am I in purgatory
about to face eternal damnation?

MoonMan

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2