I recently read an article concerning board finishes. One of the finishes specified was Electroplated Tin/Lead.  I have not heard of this process before, I'm only familiar with Electroplated Tin.  What I read is that it is vary flat and works well with Fine Pitch and BGA components.

Does any one out their have any information they could share concerning this issue.  What are the pros and cons of this board finish.


Scott Lefebvre
Mfg. Engineer
ADC
530-265-1041
[log in to unmask] <[log in to unmask]>

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------