Werner,

Before you hit the slopes - two last questions.

In point #2, do you mean exactly what is written: that the non-functional
pads reduce the possibility of hole wall separation?  Or do you mean that
the presence of additional anchors reduces the propagation or magnitude of
separation when it occurs?

How does the presence of additional pads reduce the possibility of inner
layer separation?  My understanding is that the adhesion of b-stage to
c-stage is greater than the adhesion of polymer to copper.

Don Vischulis

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: Friday, January 18, 2002 10:11 AM
To: [log in to unmask]
Subject: Re: [TN] Remove unused "dead" pads on internal layers


snip----------
2. 'Non-functional' lands do provide a 'wall achor' [as Peter terms them]
reducing the possibility of hole wall separation and innerlayer separation
after solder temperature excursions;
snip--------

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