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January 2002

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 3 Jan 2002 08:55:25 -0500
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text/plain
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text/plain (62 lines)
Section 5 of IPC-A-610C
Inspection usually starts with a general overall view of the electrnic
assembly, then follows each componet/wire to its connectin, concentrating on
the lead into the connection, the connection and the tail end of the
lead/wire leaving the connection. The wire/eald protrusion step for all
lands should be saved for last so that the board can be flipped over and all
connection checked together. (Obviously addressing a through hole or mixed
technology board.)

The J-STD-001 encourages sampling but does not directly give guidance.
IPC-9191 which superseeded IPC-PC-90 might help with implementation.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Olivia Mc Dermott
> Sent: Thursday, January 03, 2002 6:11 AM
> To: [log in to unmask]
> Subject: [TN] Final Audit/Inspection
>
>
> Good Morning and Happy New Year.
> This is my 1st message to technet.
>
> Can you suggest a methodology/systematic approach to final inspection of
> populated PCBs? Do you check firstly for component orientations,
> placements
> or acceptability of the soldered joints? Is the drawings mapped out as to
> where to start the inspection (topside, bottomside, left/right hand side)
> Should there be 100% inspection or inspection to some type of sampling
> procedure? Does IPC have a recommended standard for this and where could I
> find the information? I would be interested to know what you use.
>
> Thanks in advance for any replies.
>
> _________________________________________________________________
> Get your FREE download of MSN Explorer at
http://explorer.msn.com/intl.asp.

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