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January 2002

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Subject:
From:
"<Peter George Duncan>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 18 Jan 2002 14:43:08 +0800
Content-Type:
text/plain
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text/plain (82 lines)
Rick,

You will, of course require one via per BGA ball, and the only places to
put them are either adjacent to the pad or in the pad itself. There just
ain't no room to do surface fanout to the outside of the foot print.
Conversely, there ain't enough room to put other vias inside the footprint,
other than the ball interconnect vias, 'coz all the space is taken up.

Or am I missing something here?

Peter




                    Rick Howieson
                    <RHowieson@DELTAGRO        To:     [log in to unmask]
                    UPINC.COM>                 cc:     (bcc: DUNCAN Peter/Asst Prin Engr/ST
                    Sent by: TechNet           Aero/ST Group)
                    <[log in to unmask]>          Subject:     [TN] BGA/Vias


                    01/17/02 01:41 AM
                    Please respond to
                    "TechNet E-Mail
                    Forum."; Please
                    respond to
                    RHowieson






We have a board with a BGA that has quite a few vias on the board located
under the BGA. My question is...Should there be a limit of vias on the
board
located under the BGA? When we need to rework the BGA that area of the
board
seems to "sink" causing more problems, not to mention the integrity of the
vias.
Thanks,
Rick Howieson
Delta Group Electronics, Inc.

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