dear all,.

GREETINGS AND GOOD WISHES FOR A HAPPY AND PROSPEROUS NEW YEAR

We have  been a manufacturer of  Multilayer PCBs of higher layer counts
(8 to 18 layers) with aluminum

core and thermal bond options .  These are being used for high end
professional applications in the areas of SPACE and AVIONICS.

We are interested in knowing the following details as per the subject
above.

a) Surface preparation of  CIC material of different grades and
thicknesses.
b) Material and method of  Insulation (electrical) for the different inner
layers and the CIC Core layer
c) Method  of  Insulation and Connectivity for the PTH  with CIC Core and
inner layers including Through,Burried,
    BLIND and Interconnection holes
d)Any specific parameters differences from the normal  CCL/PREPREG-FR4
combination for critical processes
   like electroless.desmear/etchback,drilling etc.,for the CIC  C ORE
Integrated PCBs

Request your valuable feedback to our queries

Regards,

M A Ranganath
GM - Engineering & Quality
Sanmar Micropack Limited
Plot No.16, Jigani Industrial Area,
Bangalore - 562 106. INDIA
Phone: 91 - 80 - 7825223/224/226/389
Fax     : 91 - 80 - 7825225
Email  : [log in to unmask]








         * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *



 The   information  contained  in  this message is  legally  privileged and
 confidential   information  intended  only   for the use of  the addressed
 individual   or  entity   indicated  in this  message (or  responsible for
 delivery   of  the  message to such person).  It must not be read, copied,
 disclosed,  distributed  or  used  by any person other than the addressee.
 Unauthorised  use, disclosure or copying is strictly prohibited and may be
 unlawful.

 Opinions, conclusions  and other information on  this message  that do not
 relate  to  the  official business of  any of the constituent companies of
 the  SANMAR GROUP  shall  be  understood as  neither given nor endorsed by
 the Group.

 If  you   have  received  this  message in error,  you should destroy this
 message and kindly notify the sender by e-mail.

 Thank you.

         * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------