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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 16 Jan 2002 12:40:58 -0700 |
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I probably didn't make myself clear. The problem is the board itself
collapses/sinks/"potato chips"...in the area being heated, i.e. BGA
location.
Rick
-----Original Message-----
From: Earl Moon [mailto:[log in to unmask]]
Sent: Wednesday, January 16, 2002 11:36 AM
To: [log in to unmask]
Subject: Re: [TN] BGA/Vias
Agree with that. Without board reaching equillibrium (spelling?) top to
bottom, no even solder joint formation (in the case of BGA's - ball
collapse) possible. Uneven "sinking" (collapse) bound to occur but usually
within nanoseconds of others - depending on thermal conditions.
MoonMan
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