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January 2002

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 16 Jan 2002 13:36:09 -0500
Content-Type:
text/plain
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text/plain (54 lines)
It's probably not the vias under the BGA causing the board to sink. You are
seeing the response of the board to isolated expansion caused by heating a
small portion of the board. Try preheating a larger portion of the bottom
side of the board. It is very common to have vias under the BGA, they
provide escapes for the I/O in the array.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Rick Howieson
> Sent: Wednesday, January 16, 2002 12:41 PM
> To: [log in to unmask]
> Subject: [TN] BGA/Vias
>
>
> We have a board with a BGA that has quite a few vias on the board located
> under the BGA. My question is...Should there be a limit of vias
> on the board
> located under the BGA? When we need to rework the BGA that area
> of the board
> seems to "sink" causing more problems, not to mention the integrity of the
> vias.
> Thanks,
> Rick Howieson
> Delta Group Electronics, Inc.
>
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