Know your situation. HP and Celestica, for most smart customers, had a
rework plan, and proof of its capability, as part of DFM.

For Cray, on one project with which I was involved, we had a 42 layer board
made for purposes of proving 24 rework requirements involving 1200 I/O
CCGA's and 3400 I/O MCM's. I bring this up as you mentioned meeting spec.
Are you talking to 7711 and/or 7721 requirements (whichever is the rework
guideline) or other?

One of our rework processes involved using a fairly accurate overhead drill
machine, with micromoter adjustments and microscope, to remove copper from
holes in the test board mentioned above. I was crappy at it, but once shown
to quality operators (the best folks on the planet), the just did it and
inserted very fine gauge wire and soldered each side as if it was a breeze.

Anyway, the only way I know to get the copper out, is to drill it. Wish I
could help more after the deed (design) is done, but without benefit of up
front planning, via DFM/CE, it can be tough.

Hell, MoonMan isn't on that rant again. Earl Moon says it sure sounds that
way but maybe there's someting there for next time.

MoonMan, or is it Earl Moon, or who cares?

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------