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January 2002

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Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 14 Jan 2002 09:24:19 -0600
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Guy,

The cave is quite resplendent with most ameneties. HASL is not one of them.

Werner once responded, accurately, any process can be mis-managed as in the
HASL thing. One thing that cannot be managed is the copper surface of a
board about to enter HASL hell. The copper surface is cleaned, micro-etched,
rinsed, dried (wherein the biggest process mis-management occurs), then
introduced to fluxes often incapable of removing the oxidation imparted by
the drying process. This is my big gripe against HASL now that I've grown so
fond of very "thick" IMC's.

Amazingly, I have seen HASL surfaces very flat, shiney, bright, and
solderable. I don't remember where I saw this phenomonom. Probably in my
dreams but it was a wonder. I also wonder, if it was not a dream, where
these conditions were produced. Any board fab folks out there?

As for popping my head out of the cave, it gets very lonely in here, or not,
and fresh air always is appreciated. However, I'm not a weather reporter
based on shadow. What's with this strange passage. No snow covering my cave
opening.

MoonMan

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