Here's a link with some information
http://www.pcfab.com/db_area/archive/2000/0010/dfe.html
and another
http://www.smta.org/knowledge/proceedings_abstract.cfm?PROCEEDING_ID=571

In a nutshell, IMHO, Nothing solders or protects like HASL but, it may not
provide a level enough finish for some applications.

All immersion tins are not equal and they do not protect the copper as well
as HASL. But they do provide a level surface on which to place components.

As for Nickel Gold, you are not soldering to copper but nickel. The finish
is flat but the solder process may not exhibit the same wetting as with a
good HASL, OSP, SN or Ag finish. There are many discussions of Black Pad in
the technet archives.

Immersion silver is well liked and seems to provide good process results.
May not be as robust as HASL.

OSP works good but, the first time you find out if you can plate to the
copper on the board is when you try to solder to it. That can be a little
late.

This is far from "all advantages and disadvantages" but such a reply would
require one to follow MoonMan's steps to a cave.


> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Zweigart, Siegmund
> Sent: Monday, January 14, 2002 9:15 AM
> To: [log in to unmask]
> Subject: [TN] finish
>
>
> Dear All
>
> I am looking about a comparison of different Finishes of PCBs (HASL, chem.
> Tin, NiAu, chem. Ag, OCC .....) with all advantages and disadvantages.
> Also I am interested in details about the plating procedure for these
> finishes.
> Is there any information available?
>
> Siggi
> ------------------------------------------------------------------
> ----------
> -
> Kind regards / Mit freundlichen Grüßen
>
> Dr. Siegmund Zweigart
> New Technology Manager
>
> Solectron GmbH
> Solectronstrasse 2              Fon. ++49 7032 998 194
> D - 71083 Herrenberg         Fax  ++49 7032 998 49 222
>
> e-mail: [log in to unmask] <mailto:[log in to unmask]>
> internet: www.solectron.com <http://www.solectron.com>
> ------------------------------------------------------------------
> ----------
> -
>
> ------------------------------------------------------------------
> ---------------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL
> To recieve ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search previous postings at: www.ipc.org > On-Line Resources &
> Databases > E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> ------------------------------------------------------------------
> ---------------
>

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To recieve ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------