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January 2002

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Subject:
From:
Steve Telgen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 14 Jan 2002 08:43:46 -0500
Content-Type:
text/plain
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text/plain (61 lines)
Pat,
Most board shops remove unused pads to reduce the possibility of etch or
imaging problems, especially with false AOI errors. I don't believe Class 3
addresses this.  On some designs its better to leave the pads on if there's
going to be excessive fill necessary.  To Steve's point, I don't understand
how a copper pad would prevent glass fiber tear-away.  Sound more like his
fab-house fixed a drilling problem.  If there is a benefit to leaving them
on, I'd like to know.
Steve Telgen

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Patrick Lam
Sent: Friday, January 11, 2002 17:12
To: [log in to unmask]
Subject: [TN] Remove unused "dead" pads on internal layers


Hi TechNetters,

For class 3 boards, is it acceptable to have unused pads removed on
interanal
layers.

Thanks,
Pat
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