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January 2002

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Subject:
From:
Neil Flatter <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 11 Jan 2002 02:18:29 -0500
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What sorts of options are there for the flux?  Anything I've read either uses zinc chloride or simply skirts the issue.  I'm trying to get some idea of the contamination to expect on finished assemblies.

Neil Flatter
Process Quality
TRW Automotive

>>> [log in to unmask] 01/11/02 12:00AM >>>
Date:    Thu, 10 Jan 2002 15:43:41 -0500
From:    Gary Bremer <[log in to unmask]>
Subject: Lead Free Soldering

I am looking at moving my soldering process to use leadfree solder
sometime this year.  Has anyone already shifted over to using
leadfree solder?  What type of problems would I expect to
encounter with using a leadfree solder?  The solder material that
NEMI is suggesting is SnAgCu, is this going to pose any real
problems because the temperature is at 217=B0 Celsius with the
laminate material or what components are selected?  Will I be
forced to change the finish on the bare board from HASL?  Any help
or suggestions I get will be greatly appriciated.

Gary Bremer,
Manufacturing Engineer

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