Hey Gary,

Not to be sarcastic or anything, but you would want to get rid of HASL if
you want to make an attempt to be lead free!- although good luck getting
component suppliers to "get the lead out"..  Electroless Nickel Immersion
Gold (ENIG), Immersion Silver or Immersion Tin might be a good alternative
for surface finish.  If you are doing straight SMT you could even go with an
OSP.  If you have a mixed technology process, you might want to check the
capabilities of your wave solder equipment, and consider that the elevated
preheat for wavesolder might affect some low temp topside TH devices.

Steve A

> -----Original Message-----
> From: Gary Bremer [SMTP:[log in to unmask]]
> Sent: Thursday,January 10,2002 1:44 PM
> To:   [log in to unmask]
> Subject:      [TN] Lead Free Soldering
>
> I am looking at moving my soldering process to use leadfree solder
> sometime this year.  Has anyone already shifted over to using
> leadfree solder?  What type of problems would I expect to
> encounter with using a leadfree solder?  The solder material that
> NEMI is suggesting is SnAgCu, is this going to pose any real
> problems because the temperature is at 217? Celsius with the
> laminate material or what components are selected?  Will I be
> forced to change the finish on the bare board from HASL?  Any help
> or suggestions I get will be greatly appriciated.
>
> Gary Bremer,
> Manufacturing Engineer
>
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