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January 2002

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Subject:
Re: hole wall pull away and resin recession
From:
"Tempea, Ioan" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 10 Jan 2002 10:45:05 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (158 lines) 
Joseph,

the annealing normally precedes lamination, so it does not make the metals
more brittle, but ductile.

Ioan

> -----Original Message-----
> From: Joseph Spicuzza [SMTP:[log in to unmask]]
> Sent: Thursday, January 10, 2002 11:37 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] hole wall pull away and resin recession
>
> Thanks Steve,
> A follow up question: Does the copper then get more brittle? To a point
> that
> the processing should change?
> Joe
>
>
> Quoting Steve Owen <[log in to unmask]>:
>
> > Joseph,
> >
> > Anneal
> > 1 To temper or toughen (something) by heat treatment to remove internal
> > stress, crystal defects, and dislocations.
> >
> > Steve.
> >
> > -----Original Message-----
> > From: Joseph Spicuzza [mailto:[log in to unmask]]
> > Sent: 10 January 2002 15:48
> > To: [log in to unmask]
> > Subject: Re: [TN] hole wall pull away and resin recession
> >
> >
> > Rich,
> > I must be braindead this morning, expound on "anneals" if you would,
> > rather, remind me what that means.
> > Thanx
> > braindead Joe
> >
> > Quoting [log in to unmask]:
> >
> > > Joe
> > >
> > > remember that baking also anneals the copper
> > >
> > > Rich Fudalewski
> > >
> >
> >
> >
> > Joseph Spicuzza
> > Quality Assurance Supervisor
> > Advanced Interconnect Products Division
> > Compunetics, Inc.
> > ph: 412 858-6166
> > fax 412 373-8060
> > [log in to unmask]
> >
> >
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>
> Joseph Spicuzza
> Quality Assurance Supervisor
> Advanced Interconnect Products Division
> Compunetics, Inc.
> ph: 412 858-6166
> fax 412 373-8060
> [log in to unmask]
>
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