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January 2002

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From:
Brian Ellis <[log in to unmask]>
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TechNet E-Mail Forum.
Date:
Wed, 2 Jan 2002 19:20:07 +0200
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Vinit

I think it should also be mentioned that, if U/S weakens a bond, a fault
may not occur until several months later: it may be a time bomb :-(

Brian

Vinit Verma wrote:
>
> Hi Technetters,
>
> I am presently evaluating post reflow PCB cleaning machines, both aqueous
> and ultrasonic. I have a concern regarding ultrasonic cleaning. Read
> somewhere that the ultrasonic frequencies can have an effect on the wire
> bonds inside the packaging. Does anyone have any idea of this?
>
> Thanks in anticipation.
>
> Regards
> Vinit Verma
>
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