TECHNET Archives

January 2002

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
Date:
Mon, 14 Jan 2002 23:51:31 -0800
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Peter Lee <[log in to unmask]>
Subject:
MIME-Version:
1.0
Content-Transfer-Encoding:
7bit
In-Reply-To:
<001401c19d8b$13452c80$4bc9d7cc@davidfis>
Content-Type:
text/plain; charset="us-ascii"
From:
Peter Lee <[log in to unmask]>
Parts/Attachments:
text/plain (30 lines)
Hi,

Does anyone know what is the most common plating finish specified on the
PCB RF shielding? I have seen poor solderability on shields with nickel
finish compared with tin finish after SMT reflow soldering.

Should the RF performance a concern when selecting the proper plating
material?


Rgds,
Peter



_________________________________________________________
Do You Yahoo!?
Get your free @yahoo.com address at http://mail.yahoo.com

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2