LEADFREE Archives

January 2002

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Subject:
From:
Joseph Fjelstad <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Thu, 10 Jan 2002 18:18:20 EST
Content-Type:
text/plain
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text/plain (17 lines)
Hi Jack

The reference you provided appears to relate more to potentially native impurities and does not address intentional use of lead (which is how I read the question)such as is use in C4 bumps where it is used purposefully to assure highest levels of reliability.

Very best,
Joe

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