Dear Hans:
Indeed, your summary is accurate. While we expected plating to be a
challenge it was the easier part of solving the lead free puzzle. The high
temperatures of processing are the biggest challenges. We have developed an
engineering specification for connector materials for higher temp reflow
processes based on the physical and thermal properties of the resins. I
published a little bit of data on some wave solder and reflow solder testing
on connectors at IICIT last fall (1). Two other publications I am aware of
are listed below regarding plastic material performance in these
environments. Note that these have conflicting conclusions about the
viability of PBT materials for lead free applications.
(1) "Achieving Lead Free Connectors and Processes", R. Hilty, IICIT Annual
Conference, October 2001, pp 195.
(2) "Lead-free Solder: Effect of Increased Reflow Temperature on Dielectric
Housing Materials", Steve Angeli (FCI), ETP 2001.
(3) "Thermoplastic Connector Housings in a Lead-Free Wave Soldering
Environment", Gerald Keep (Eastman Plastics), SMTA conference, 2001.
Cheers,
Bob Hilty
Tyco Electronics
-----Original Message-----
From: <Hans Juergen Bauer> [mailto:[log in to unmask]]
Sent: Wednesday, January 09, 2002 5:47 AM
To: [log in to unmask]
Subject: Re: [LF] Lead-Free Question: Component Supplier Plans/Readiness
Hello,
to be very clear, the question is not only a leadfree area for connection,
this is a marginal metallurgical/electroplating
problem, it is the capability of the component to withstand the higher
reflow process profiles with nearly the same
slight changes of characteristics (reliability inclusive), as with an good
old tin/ lead process. Who is qualifying this?
Component manufacturing industries? What about Al-electrolyte,
Polyester-caps, Polypropylen-caps, Tantalums,
Connectors, a.s.o.?
With kind regards,
Hans Juergen
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