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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 31 Jan 2002 11:37:38 -0600 |
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Jeff,
It is my opinion that pasting the board enhances wetting and a superior joint.
Jason Gregory
Software Specialist
Sanmina-SCI - Tech Center Austin
15508 Bratton Lane
Austin, Tx. 78728
(512)246-5648
[log in to unmask]
>>> [log in to unmask] 01/31/02 10:54AM >>>
Fellow TechNetters,
We nearly always apply solder paste to the circuit board when we replace
BGA components during rework. Yet, after speaking with a handfull of BGA
equipment companies at APEX, seems like they all recommend using flux only
vs. paste, unless the circuit board is used in a high rel application.
What do ya'all do/recommend for BAG rework? Can you point me to any
studies/reports on the subject?
Thanks,
Jeff Ferry
CEO
Circuit Technology Center, Inc.
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