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January 2002

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MAURY HARRIS <[log in to unmask]>
Date:
Tue, 15 Jan 2002 16:42:12 -0500
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"TechNet E-Mail Forum." <[log in to unmask]>, Guy Ramsey <[log in to unmask]>
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Guy Ramsey <[log in to unmask]>
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IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Clasification for Plastic
Integrated Circuit Surface Mount Devices

IPC/JEDEC J-STD-033 Standard for handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of MAURY HARRIS
> Sent: Tuesday, January 15, 2002 3:05 PM
> To: [log in to unmask]
> Subject: [TN] PWB Moisture
>
>
> Anyone,
>
> What is the max absorbed moisture a PWB may have prior to reflow
> soldering?
> Also, what IPC or Mil-Spec addresses PWB moisture?
>
> Thank you,
>
> Maury Harris
> EFTC-SCO Engineering
> 602 282-5179
> [log in to unmask]
>
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