Sender: |
|
Date: |
Mon, 14 Jan 2002 08:43:46 -0500 |
Reply-To: |
|
Subject: |
|
MIME-Version: |
1.0 |
Content-Transfer-Encoding: |
7bit |
In-Reply-To: |
|
Content-Type: |
text/plain; charset="iso-8859-1" |
From: |
|
Parts/Attachments: |
|
|
Pat,
Most board shops remove unused pads to reduce the possibility of etch or
imaging problems, especially with false AOI errors. I don't believe Class 3
addresses this. On some designs its better to leave the pads on if there's
going to be excessive fill necessary. To Steve's point, I don't understand
how a copper pad would prevent glass fiber tear-away. Sound more like his
fab-house fixed a drilling problem. If there is a benefit to leaving them
on, I'd like to know.
Steve Telgen
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Patrick Lam
Sent: Friday, January 11, 2002 17:12
To: [log in to unmask]
Subject: [TN] Remove unused "dead" pads on internal layers
Hi TechNetters,
For class 3 boards, is it acceptable to have unused pads removed on
interanal
layers.
Thanks,
Pat
This e-mail may contain SEL confidential information. The opinions
expressed
are not necessarily those of SEL. Any unauthorized disclosure, distribution
or
other use is prohibited. If you received this e-mail in error, please
notify
the sender, permanently delete it, and destroy any printout. Thank you.
----------------------------------------------------------------------------
-----
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET
Technet NOMAIL
To recieve ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
----------------------------------------------------------------------------
-----
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To recieve ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|
|
|