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December 2001

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 3 Dec 2001 08:28:18 EST
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Hi All,
I asked for some of this information before, but got no response. I am trying
to assess the impact of the various thermal masses of components on their
different reflow temperature profiles.
However, I do not have enough information. I would appreciate any information
any of you could provide. Components of interest are listed below, the number
of I/O's could vary of course. What I need is body dimensions, possible chip
sizes, component substrate thickness, metal content, etc.:
0603 Chip
1803 Chip
100 I/O QFP
Plastic 361 I/O BGA
Plastic 361 I/O SBGA
Ceramic 361 I/O BGA

Thanks,
Werner Engelmaier

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